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Integrated PCB Compound Thermal Insulation Board for Building Thermal Insulation Structure
编号:S000072466 刷新日期: 有效日期至:2026-09-20 浏览:2831 对接邀请:0
意向价格: 面议
行业分类: 装备制造业
所在区域:中国 - 河北 技术领域:智能制造 - 建材行业
转让类型:技术转让
专利类型: 技术成熟度:可以量产
供应描述

Project Name: Integrated PCB Compound Thermal Insulation Board for Building Thermal Insulation Structure

Project Owner: Hebei Pengrun Building Materials Technology Co., Ltd.

Project Profile: Hebei Pengrun Building Materials Technology Co., Ltd. adopts formwork construction process to innovate PCB composite insulation board, which not only has the function of heat preservation and energy conservation, but also has the function of wall formwork. The hidden danger of fire before and after construction was solved by 3-hour fire-resistant limit test. At the same time, it overturns the traditional construction method of external thermal insulation and adhesive anchor, realizes the simultaneous construction of the building wall and thermal insulation, completes the construction together, and realizes coexistence with building life.

 

 

Contact Person: Liu Xuewei

Phone Number: 18831230068


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机构地址:宁夏银川市金凤区新昌西路紫荆花商务中心B座四楼 查看地图
中国-阿拉伯国家技术转移中心
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